PA46

Polyamide 4.6 is a semi-crystalline aliphatic polyamide with a very high
melting point. In the series of polyamides (PA12, PA11, PA6, PA6.6) the
number(s) refers to the amount of carbon atoms between the amide
functional groups (NH), in the case of PA 4.6 the carbon atoms alternating 4 and 6.
Lower numbers mean that there are more functional groups in the chain
which form the strong hydrogen bonds, resulting in a higher melting
temperature. PA 4.6 has the highest amide group density, therefore the
highest melting point of all commercial polyamides. It also has a very high
crystallinity (70%), which keeps the Young's Modulus very high up to temperatures
close to the melting point. This makes PA 4.6 ideal for applications where
components experience (occasionally) very high temperatures, such as in
automotive parts close to the engine or in electronics, where (lead-free)
soldering requires extreme temperature resistance.

Specific properties
Density: 1.18 g/cm3. (Higher for glass filled grades).

Mechanical properties: Very high stiffness and strength when dry, but
much lower when moisture conditioned (at temperatures below the Tg).
At higher temperatures there is little difference between dry and conditioned.
Low coefficient of friction and high wear resistance. High level of toughness.

Thermal properties: Tg around 78 °C (dry, conditioned lower), Tm 295 °C.
Stable at long term high temperature applications.

Chemical resistance: very good resistance against many organic solvents,
oils and greases. Less resistant to strong acids and bases.

Colour/surface
White opaque with glossy surface. Only high temperature pigments can
be used due to the high processing temperature.

Processing
Very good flow in thin walls and extremely short cycle times are possible.

Applications
Electronics: (miniature) connectors, sockets for memory modules
and processors, LED’s, (miniature) printed circuit boards
Automotive: lighting components, turbocharger inlet / intercooler,
gears, transmission components, drive belt tensioners, sensor
encapsulation
Industrial: gears, transmission components, films, fibers for belts
and composites
Aerospace: turbine engine components, connectors

Polyamide 4.6

Young's modulus 2000 MPa
Shear modulus 1200 MPa
Tensile strength 100 MPa
Elongation 40 %
Bending strength 150 MPa
Hardness 123 Rockwell
Yield strength 30 MPa
Thermal expansion 75 E-6/K
Thermal conductivity 0.3 W/m*K
Specific heat 2100 J/kg*K
Vicat 270 °C
Melting temperature 272.5 °C
Glass temperature 85 °C
Minimum service temperature -60 °C
Maximum service temperature 160 °C
Density 1180 kg/m3
Resistivity 1E+17 Ohm*mm2/m
Breakdown potential 60 kV/mm
Dielectric loss factor 0.1815
Friction coefficient 0.4
Refraction index 77.265
Water absorption 4 %